In order to reduce the temperature of the active area of the micro disk cavity semiconductor laser and improve the reliability of the package.Use ANSYS Workbench to simulate the temperature distribution, thermal stress and thermal strain distribution of the micro disk cavity semiconductor laser with different transition heat sink package.The results show that the minimum thermal stress is introduced into the SiC package, and the temperature of the active region is also significantly reduced, which is 2.18 ℃ and 3.078 ℃ lower than the traditional transition heat sink AlN ceramic chip and WCu10 package, respectively. Graphene and CVD diamond have the best heat dissipation effect, but the thermal stress is about twice as high as AlN packaging and 2.06 as high as SiC packaging.SiC packaging can effectively reduce the temperature of active region, package stress and package strain, improve the reliability and heat dissipation of semiconductor laser .