Wuhan University of Science and Technology, Hubei Key Laboratory of Mechanical Transmission and Manufacturing Engineering
High junction temperature and uneven illumination of high-power cob light source board are caused by high-density LED chip layout. This paper studies the LED chip layout. Aiming at achieving the saturation of illumination on the target surface, the paper constructs a multi-circular LED chip layout by studying the relationship between the size of the circle and the number of LED chips on the circle. The temperature rise of two LED chips with different spacing was analyzed by finite element simulation, and the temperature distribution model of the overall LED chip layout was constructed by fitting the relationship curve between the spacing of two LED chips and the coupled temperature rise; The illumination distribution model of the overall LED chip layout is constructed by the derivation of the illumination distribution model of a single chip; The simulated annealing mechanism is introduced into the particle swarm optimization algorithm, and the logarithmic function parameters are optimized with the normalized weighting function of illumination variance and maximum temperature as the objective. Under the same conditions, numerical simulation is carried out for the light source board with the traditional equidistant LED chip layout and the logarithmic function led chip layout. Compared with the simulation results, it is found that the light source board with the optimized logarithmic function led chip layout has higher illumination uniformity and lower maximum temperature, which indicates that the SA-PSO algorithm is more ideal for the optimization of LED chip layout parameters.