空封光电耦合器内部多余物颗粒PIND检测概率研究
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重庆光电技术研究所

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Research on PIND Detection Probability of Remainder Particles in Empty Sealed Optocoupler
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Chongqing Optoelectronics Research Institute

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    摘要:

    空封光电耦合器在PIND试验中对内部多余物颗粒的检测概率对于检测效果和器件可靠性具有重要意义,本文提出了利用电压采样数据分析PIND检测概率的模型,针对常见多余物颗粒类型制作试验样品并采样后,研究表明短金丝的检测概率较稳定且远大于陶瓷颗粒和导电胶颗粒在碰撞陶瓷内壁时的检测概率,但导电胶颗粒的检测概率在提高试验频率后有明显改善,据此提出了加强多余物颗粒控制与检测的措施,所用分析模型和研究方法可推广至其他空封元器件的PIND检测概率研究中。

    Abstract:

    In PIND test,the detection probability of remainder particles in empty sealed optocoupler is of great significance to the detection effect and device reliability. In this paper, a model of PIND detection probability analysis based on voltage sampling data is proposed. After making test samples according to the common types of remainder particles and sampling, the research shows that the detection probability of short gold wire is stable and far greater than that of ceramic particles and conductive adhesive particles when they collide with ceramic inner surface, but the detection probability of conductive adhesive particles is obviously improved after increasing test frequency. Based on this, the measures to strengthen the control and detection of remainder particles are put forward. The analysis model and research method can be extended to research of PIND detection probability in other empty sealed components.

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  • 收稿日期:2020-10-24
  • 最后修改日期:2020-10-24
  • 录用日期:2020-11-12
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